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EFM 4

The EFM 4 is intended for the deposition on substrates with a diameter up to 50 mm. Evaporation rates vary from 1/10 monolayer per minute to over 1000 monolayers per second.

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The EFM 4 is intended for the deposition on substrates with a diameter up to 50 mm. Evaporation rates vary from 1/10 monolayer per minute to over 1000 monolayers per second.

The EFM 4 is suitable for crucible capacities up to 600 mm3. The effective water-cooling ensures low background pressure (typically in the 10-10 mbar range) even during prolonged operation at high evaporant temperatures.

The area of highly uniform deposition is selected by choosing one of three different exit apertures.

Microprocessor for EFM 4